ASIC Chip Lead
Job Description
Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: Job Description Leading and implementing chips in various high-volume consumer devices to Satellite projects from ultra-low power 40nm nodes, 16nm to 7nm. Physical implementation of the blocks and top-level. Floorplanning including multi-power domain, PG …
This is the short summary Adzuna shares. The full advert — duties, requirements and pay — is on the original listing.
Read the full advertWhat we know about Broadcom
- Industry
- Manufacturing
- H-1B filings on record
- 2009–2023
- Filing location
- Irvine, CA
- Employment permits
- 1 in 2024 (1 in 2022)
USCIS H-1B data hub
Available in 2 Locations
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